Report date: Feb 24,2026
Conflict count: 372435
Publisher: IMAPS - International Microelectronics Assembly and Packaging Society
Title count: 1
Conflict count: 1


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Created: 2026-01-27 14:01:10
ConfID: 8615256
CauseID: 1730977027
OtherID: 1725813996
JT: IMAPSource Proceedings
MD: Pereira,2025,dpc,,2025,AI Market Today and Beyond: Transforming the Future of Advanced Packaging
DOI: 10.4071/001c.153866(Journal) (8615256-N)
DOI: 10.4071/001c.147787(Journal)