Report date: Apr 30, 2024 Conflict count: 350192 Publisher: Sage Publications - Technomic Publishing Company Title count: 9 Conflict count: 161 ========================================================== Created: 2017-07-03 09:12:21.0 ConfID: 5267564 CauseID: 1408601152 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: BUDAIWI, 23 ,2,123,1999,Impact of Indoor Air Conditions and Solar Radiation on Moisture Accumulation within Multi-Layer Non-Cavity Walls DOI: 10.1106/PFCF-1L2D-W5XA-J97F(Journal) (5267564-N ) DOI: 10.1177/109719639902300203(Journal) ========================================================== Created: 2017-07-03 09:12:21.0 ConfID: 5267565 CauseID: 1408601152 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: KOSSECKA, 23 ,2,145,1999,Method of Averages to Determine Insulation Conductivity under Transient Conditions DOI: 10.1106/P42L-43AV-2EQ4-TCLK(Journal) (5267565-N ) DOI: 10.1177/109719639902300204(Journal) ========================================================== Created: 2017-07-03 09:12:21.0 ConfID: 5267566 CauseID: 1408601152 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: SWINTON, 23 ,2,173,1999,In situ Performance of Expanded Molded Polystyrene in the Exterior Basement Insulation Systems (EIBS) DOI: 10.1106/LTQF-BUT9-K823-L8P4(Journal) (5267566-N ) DOI: 10.1177/109719639902300206(Journal) ========================================================== Created: 2017-07-03 09:12:22.0 ConfID: 5267567 CauseID: 1408601161 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: Bomberg, 23 ,1,4,1999,LETTER FROM THE EDITOR DOI: 10.1106/X6CB-99XB-R8LE-QKFA(Journal) (5267567-N ) DOI: 10.1177/109719639902300101(Journal) ========================================================== Created: 2017-07-03 09:12:22.0 ConfID: 5267568 CauseID: 1408601161 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: ROELS, 23 ,1,17,1999,Simulating Non-Isothermal Water Vapour Transfer: An Experimental Validation on Multi-Layered Building Components DOI: 10.1106/T0YY-CKA8-JMDX-FHEB(Journal) (5267568-N ) DOI: 10.1177/109719639902300104(Journal) ========================================================== Created: 2017-07-03 09:12:22.0 ConfID: 5267569 CauseID: 1408601161 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: STRAUBE, 23 ,1,41,1999,Rain Control and Design Strategies DOI: 10.1106/XVJ7-XNGB-7WDQ-DY0U(Journal) (5267569-N ) DOI: 10.1177/109719639902300105(Journal) ========================================================== Created: 2017-07-03 09:12:22.0 ConfID: 5267570 CauseID: 1408601161 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: EDGAR, 23 ,1,57,1999,Performance of Source Drainage External Insulation Finish System at the Window/Wall Junction DOI: 10.1106/A2WU-6HLJ-KAH8-TQU6(Journal) (5267570-N ) DOI: 10.1177/109719639902300106(Journal) ========================================================== Created: 2017-07-03 10:18:42.0 ConfID: 5267650 CauseID: 1408607270 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: null, 24 ,1,3,2000,The Duty of Civility DOI: 10.1106/TM41-FC2R-KUU7-GK9W(Journal) (5267650-N ) DOI: 10.1177/109719630002400101(Journal) ========================================================== Created: 2017-07-03 10:18:42.0 ConfID: 5267651 CauseID: 1408607270 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: KATSMAN, 24 ,1,10,2000,Model for Moisture-Content Evolution in Porous Building Elements with Hygro-Thermal Bridges and Air-Voids DOI: 10.1106/FDJ1-FA5L-E3LB-BDHX(Journal) (5267651-N ) DOI: 10.1177/109719630002400102(Journal) ========================================================== Created: 2017-07-03 10:18:42.0 ConfID: 5267652 CauseID: 1408607270 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: HOKOI, 24 ,1,42,2000,Freezing-Thawing Processes in Glass Fiber Board DOI: 10.1106/4TYA-DVWC-XUUY-B3WE(Journal) (5267652-N ) DOI: 10.1177/109719630002400103(Journal) ========================================================== Created: 2022-10-25 10:22:45.0 ConfID: 6663044 CauseID: 1546021856 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: MAILVAGANAM, 23 ,4,349,2000,Procedural Sequence in the Repair of Buildings DOI: 10.1106/Q55E-P8G3-5PHW-3PG6(Journal) (6663044-N ) DOI: 10.1177/174425910002300405(Journal) ========================================================== Created: 2022-10-25 10:22:45.0 ConfID: 6663045 CauseID: 1546021856 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: JANINSKA, 23 ,4,339,2000,Environmental Requirements for Fungi DOI: 10.1106/8CDT-BE1H-1R1T-CJJX(Journal) (6663045-N ) DOI: 10.1177/174425910002300404(Journal) ========================================================== Created: 2022-10-25 10:22:45.0 ConfID: 6663047 CauseID: 1546021856 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: PETRIE, 23 ,4,292,2000,Effects of Mechanical Fasteners and Gaps between Insulation Boards on Thermal Performance of Low-Slope Roofs DOI: 10.1106/FWPW-3891-JMFG-19GL(Journal) (6663047-N ) DOI: 10.1177/174425910002300402(Journal) ========================================================== Created: 2022-10-25 10:22:46.0 ConfID: 6663048 CauseID: 1546021859 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: BOMBERG, 23 ,3,244,2000,On Variability in Physical Properties of Molded, Expanded Polystyrene DOI: 10.1106/MGP7-JNCE-WF6K-R1EX(Journal) (6663048-N ) DOI: 10.1177/174425910002300307(Journal) ========================================================== Created: 2022-10-25 10:22:45.0 ConfID: 6663049 CauseID: 1546021856 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: null, 23 ,4,285,2000,Where Have All the Heroes Gone? DOI: 10.1106/NPA2-PCFK-Q0WT-WNU3(Journal) (6663049-N ) DOI: 10.1177/174425910002300401(Journal) ========================================================== Created: 2022-10-25 10:22:46.0 ConfID: 6663050 CauseID: 1546021859 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: GEVING, 23 ,3,224,2000,Hygrothermal Analysis of Building Structures Using Computer Models DOI: 10.1106/9NKL-BWKY-0LEL-B1AV(Journal) (6663050-N ) DOI: 10.1177/174425910002300306(Journal) ========================================================== Created: 2022-10-25 10:22:46.0 ConfID: 6663051 CauseID: 1546021859 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: null, 23 ,3,217,2000,Report from CMHC: Drying of Stucco-Clad Walls (Vancouver) DOI: 10.1106/KJDF-A97C-PDGY-W2FH(Journal) (6663051-N ) DOI: 10.1177/174425910002300305(Journal) ========================================================== Created: 2022-10-25 10:22:46.0 ConfID: 6663052 CauseID: 1546021859 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: null, 23 ,3,212,2000,Epilogue to the 10th Symposium of Building Physics, 1999, in Dresden DOI: 10.1106/XEDY-M2FV-80LV-RB47(Journal) (6663052-N ) DOI: 10.1177/174425910002300304(Journal) ========================================================== Created: 2022-10-25 10:22:46.0 ConfID: 6663053 CauseID: 1546021859 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: null, 23 ,3,205,2000,The Elements of Folly DOI: 10.1106/FGVD-NGKQ-WM2J-66H4(Journal) (6663053-N ) DOI: 10.1177/174425910002300303(Journal) ========================================================== Created: 2022-10-25 10:22:46.0 ConfID: 6663054 CauseID: 1546021859 OtherID: 6235 JT: Journal of Thermal Envelope and Building Science MD: Bomberg, 23 ,3,202,2000,LETTER FROM THE EDITOR DOI: 10.1106/4RXY-G6LE-2JMJ-100G(Journal) (6663054-N ) DOI: 10.1177/174425910002300301(Journal)